Patent · US Expired

Structuring method

US6454956B1 · kind B1 · utility

9Cited by

12References

33Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Engelhardt · Feldkirchen-Westerham, DE
Volker Weinrich · Paris, FR

Key dates

Filing date	Aug 3, 1998
Grant date	Sep 24, 2002
Priority date	—
Expiry date	Aug 3, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/963
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for structuring at least one layer to be structured. First, a mask is applied to the layer and the layer is structured using the mask. After the structuring step, the mask is then removed, while leaving behind redepositions of the material of the layer. The redepositions of the material of the layer are removed by mechanical polishing or chemical-mechanical polishing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.