Micromirror device package
US6455927B1 · kind B1 · utility
72Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Mar 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.