Method and apparatus for optical film stack fault detection
US6458610B1 · kind B1 · utility
13Cited by
1References
43Claims
0Family size
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Key dates
| Filing date | May 31, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and an apparatus for performing film stack fault detection. At least one semiconductor wafer is processed. Metrology data from the processed semiconductor wafer is acquired. Data from a reference library comprising optical data relating to a film stack on the semiconductor wafer is accessed. The metrology data is compared to data from the reference library. A fault-detection analysis is performed in response to the comparison of the metrology data and the reference library data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.