Flip chip semiconductor package
US6459144B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip semiconductor package is proposed, in which a dam structure is formed of an adhesive compound such as epoxy resin on a substrate around a chip. The adhesive compound has a larger coefficient of thermal expansion than that of the substrate, and generates a greater thermal contraction force for counteracting thermal stress of the substrate in a cooling process in fabrication, so as to maintain planarity and structural intactness of the substrate and chip. Moreover, the chip can be made in a manner as to expose a non-active surface thereof to the atmosphere for facilitating dissipation of heat generated by the chip, while a heat sink can be additionally disposed on the chip, so as to further improve heat dissipating efficiency of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.