Structure and process of via chain for misalignment test
US6459151B1 · kind B1 · utility
3Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure or a process of the via chain is employed to test the misalignment. The structure of the via chain includes a first via chain in the first direction and a second via chain in the second direction. Using the structure having the via chains in two different directions, the misalignment can be easily detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.