Apparatus for filling high aspect ratio via holes in electronic substrates
US6461136B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Aug 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/085
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and int…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.