Frederic Maurer
10Patents
8h-index
12Co-inventors
61Inventor score
Filing activity: Apr 30, 1998 → Jul 17, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6056191A | Method and apparatus for forming solder bumps | Electricity | 49 | Expired |
| US6452117B2 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6527158B1 | Method and apparatus for forming solder bumps | Electricity | 34 | Expired |
| US6461136B1 | Apparatus for filling high aspect ratio via holes in electronic substrates | Electricity | 24 | Expired |
| US6581280B2 | Method for filling high aspect ratio via holes in electronic substrates | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6319093A | Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement | Electricity | 16 | Expired |
| US6394334B1 | Method and apparatus for forming solder bumps | Electricity | 14 | Expired |
| US6708873B2 | Apparatus and method for filling high aspect ratio via holes in electronic substrates | Electricity | 9 | Expired |
| US6362557B1 | Ultrasonic method and actuator for inducing motion of an object | Electricity | 7 | Expired |
| US6579149B2 | Support and alignment device for enabling chemical mechanical polishing rinse and film measurements | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.