Patent · US Expired

Micromechanical component

US6465854B1 · kind B1 · utility

15Cited by

4References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Horst Muenzel · Reutlingen, DE
Helmut Baumann · Gomaringen, DE
Eckhard Graf · Gomaringen, DE

Key dates

Filing date	Sep 15, 2000
Grant date	Oct 15, 2002
Priority date	—
Expiry date	Sep 15, 2020

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C1/00269
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A device, having at least one micromechanical surface structure patterned on a silicon substrate and a cap wafer covering the at least one surface structure. The cap wafer is formed from a glass wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.