Methods for ball grid array (BGA) encapsulation mold
US6472252B2 · kind B2 · utility
18Cited by
36References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jun 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.