Patent · US Expired

Method of via patterning utilizing hard mask and stripping patterning material at low temperature

US6472315B2 · kind B2 · utility

13Cited by
6References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 14, 2001
Grant dateOct 29, 2002
Priority date—
Expiry dateMar 14, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76802
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.