Resist removal monitoring by raman spectroscopy
US6473174B1 · kind B1 · utility
4Cited by
1References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 1, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Dec 9, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/653
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various methods of inspecting a workpiece for residue are provided. In one aspect, a method of inspecting a workpiece for carbon residue includes directing coherent radiation at the workpiece to produce Rayleigh scattered radiation and Raman scattered radiation. The Rayleigh scattered radiation is filtered out. A spectrum for the Raman scattered radiation is detected and compared with a known Raman spectrum for carbon. Wafers may be inspected for residues, such as graphitic carbon, in a non-destructive way and without pump down. Deficiencies in resist stripping may be quickly identified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.