Mark R. Breen
3Patents
2h-index
12Co-inventors
41Inventor score
Filing activity: Feb 14, 1994 → Mar 16, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5508228A | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Emerging Cross-Sectional Technologies | 118 | Expired |
| US6473174B1 | Resist removal monitoring by raman spectroscopy | Physics | 4 | Expired |
| US7816203B1 | Method for fabricating a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.