Hot plate cooling method and heat processing apparatus
US6474986B2 · kind B2 · utility
41Cited by
11References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Apr 12, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D9/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate. Thus, the temperature of the hot plate can be cooled rapidly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.