Semiconductor device and process for producing the same
US6476467B2 · kind B2 · utility
37Cited by
8References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 1, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.