Method for determining coplanarity of electrical contact of BGA type packages prior to electrical characterization
US6476625B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Apr 25, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2894
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of performing electrical characterization of a chip scale package in which impressionable material, such as copper tape, is applied on a contact surface of an isolation plate of a test fixture. The isolation plate is placed on the tops of an array of electrical contacts of a chip scale package and then pressed against the array of electrical contacts so that at least some of the electrical contacts make an impression in the impressionable material. By examining the impressions in the impressionable material, the coplanarity of the tops of the electrical contacts in the array is determined. This provides a measure of how well grounded the electrical contacts in the array will be when placed in a test fixture with an isolation plate placed on the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.