Methods to generate numerical pressure distribution data for developing pressure related components
US6477447B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 1999 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Oct 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of detecting surface pressure distribution of a wafer being processed by a CMP (Chemical Mechanical Polishing) process; more specifically, the invention relates to a method of detecting pressure distribution of a wafer surface by employing pressure sensitive films located on various pressure components such as a wafer carrier, a polishing pad, and mechanical arm members of a CMP machine for detecting pressure-related data during different stages of a CMP process. Further, sensed pressure-related data are collected for feedback loop controls of digital image mapping, numeration, simulation, and forecasting, from which more mechanical components of high precision and better circuit layouts on the wafer can then be developed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.