Chi-Fa Lin
13Patents
9h-index
3Co-inventors
54Inventor score
Filing activity: Mar 19, 1998 → Dec 30, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5920792A | High density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layers | Electricity | 268 | Expired |
| US6277757A | Methods to modify wet by dry etched via profile | Electricity | 94 | Expired |
| US6477447B1 | Methods to generate numerical pressure distribution data for developing pressure related components | Electricity | 19 | Expired |
| US5969409A | Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein | Electricity | 17 | Expired |
| US6165886A | Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect | Electricity | 14 | Expired |
| US5946592A | Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein | Electricity | 12 | Expired |
| US6033987A | Method for mapping and adjusting pressure distribution of CMP processes | Performing Operations; Transporting | 11 | Expired |
| US6180997A | Structure for a multi-layered dielectric layer and manufacturing method thereof | Electricity | 10 | Expired |
| US6307268A | Suppression of interconnect stress migration by refractory metal plug | Electricity | 9 | Expired |
| US6235608A | STI process by method of in-situ multilayer dielectric deposition | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6441465B2 | Scribe line structure for preventing from damages thereof induced during fabrication | Electricity | 8 | Expired |
| US6204551A | Modified SOG coater's hot plate to improve SOG film quality | Electricity | 1 | Expired |
| US6323122A | Structure for a multi-layered dielectric layer and manufacturing method thereof | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.