Bump bonding device and bump bonding method
US6481616B2 · kind B2 · utility
0Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.