Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US6482013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1997 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Feb 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Spring contact elements having a base end portion, a contact end portion, and a central body portion. In a first embodiment, the spring contact elements provide for movement of a majority of the spring contact element characterized by a first spring constant. As the force and deflection increase, the movement of a rearward portion of the spring contact element will stop when a portion of the contact element abuts a portion of its mounting member while the movement of a forward portion will continue with a second and different spring constant. In a second embodiment, the spring contact elements include additional conductive and insulating layers formed about the contact element for controlling the impedance of the spring contact element throughout its range of motion. The additional conductive layer may be connected to ground. The spring contact elements may, in turn, be mounted on an electronic component, such as a space transformer or a semiconductor device to form a probe card assembly for effecting highly uniform pressure connections to corresponding terminals on another electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.