Substrate processing method and substrate processing apparatus
US6485203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2000 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Dec 18, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.