Pre-drilled ball grid array package
US6486545B1 · kind B1 · utility
78Cited by
12References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array (BAG) package includes a substrate having a central aperture. Traces are coupled to a lower surface of the substrate. First ends of the traces support an electronic component in the central aperture. Interconnection balls are formed on second ends of the traces. The interconnection balls extend from the second ends of the traces, through the substrate, and protrude above a second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.