Heat dissipation module for a BGA IC
US6486564B2 · kind B2 · utility
4Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Aug 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.