Yi Pan
8Patents
3h-index
12Co-inventors
50Inventor score
Filing activity: Aug 10, 1999 → Jun 1, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6204553A | Lead frame structure | Electricity | 21 | Expired |
| US9437515B2 | Heat spreading layer with high thermal conductivity | Electricity | 5 | Active |
| US6486564B2 | Heat dissipation module for a BGA IC | Electricity | 4 | Expired |
| US9583408B1 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Electricity | 3 | Active |
| US10424494B2 | Chip module with stiffening frame and orthogonal heat spreader | Electricity | 2 | Active |
| US10892170B2 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Electricity | 0 | Active |
| US10566215B2 | Method of fabricating a chip module with stiffening frame and orthogonal heat spreader | Electricity | 0 | Active |
| US10090173B2 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.