Method and apparatus for reducing migration of conductive material on a component
US6488820B1 · kind B1 · utility
11Cited by
2References
48Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support and method for reducing the migration of a conductive material is provided. In one embodiment, a support includes a chuck body having a support side and a backside. A guard electrode is disposed within the chuck body proximate the backside of the chuck body. In another aspect, a method for reducing the migration of a conductive material is provided. In one embodiment, the method includes the steps of disposing a guard electrode proximate a backside of the substrate support and applying a voltage to the guard electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.