Thermal reflow photolithographic process
US6489085B2 · kind B2 · utility
5Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jan 24, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/038
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thermal flow photolithographic process. A thermal flow photoresist is provided. A cross-linking agent is added to the thermal flow photoresist to form a high-temperature cross-linking photoresist material. A substrate having an insulation layer thereon is provided. The high-temperature cross-linking photoresist is deposited over the insulation layer. The cross-linked photoresist layer on the insulation layer is exposed to light, chemically developed and then heated to cause thermal flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.