Image sensor package having sealed cavity over active area

US6492699B1 · kind B1 · utility

Assignee

• Amkor Technology, Inc. · US

Inventors

• Thomas P. Glenn · Gilbert, US
• Steven Webster · Chandler, US

Key dates

• Filing date: May 22, 2000
• Grant date: Dec 10, 2002
• Expiry date: May 22, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815

Abstract

An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.