Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
US6494219B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.