Peter Hey
10Patents
7h-index
27Co-inventors
62Inventor score
Filing activity: Jun 7, 1995 → Jun 27, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6258220A | Electro-chemical deposition system | Electricity | 333 | Expired |
| US6258223A | In-situ electroless copper seed layer enhancement in an electroplating system | Electricity | 310 | Expired |
| US5916369A | Gas inlets for wafer processing chamber | Chemistry; Metallurgy | 60 | Expired |
| US6436267B1 | Method for achieving copper fill of high aspect ratio interconnect features | Electricity | 52 | Expired |
| US6500734B2 | Gas inlets for wafer processing chamber | Electricity | 27 | Expired |
| US6494219B1 | Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6635157B2 | Electro-chemical deposition system | Electricity | 17 | Expired |
| US6808612B2 | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio | Electricity | 5 | Expired |
| US7497932B2 | Electro-chemical deposition system | Electricity | 5 | Active |
| US6893548B2 | Method of conditioning electrochemical baths in plating technology | Chemistry; Metallurgy | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.