Chip crack stop design for semiconductor chips
US6495918B1 · kind B1 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 5, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Sep 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip, in accordance with the present invention, includes a substrate and a crack stop structure. The crack structure includes a first conductive line disposed over the substrate and at least two first contacts connected to the substrate and to the first conductive line. The at least two first contacts are spaced apart from each other and extend longitudinally along a length of the first conductive line. A second conductive line is disposed over a portion of the first conductive line, and at least two second contacts are connected to the first conductive line and the second conductive line. The at least two second contacts are spaced apart from each other and extend longitudinally along a length of the second conductive line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.