Method for detecting and categorizing defects
US6496596B1 · kind B1 · utility
13Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1999 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Mar 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A defect categorization method is described. Two or more regions are defined on a die. These regions can be repeated for other dies on the same wafer or corresponding regions on other dies on other wafers. The wafer(s) are scanned for defects. The location of each defect, along with any other desired defect data is stored. The stored defect data is then categorizing by region or regions within a die. As a result of the categorization, optional defect generation predictions can be made or optional yield or kill ratio predictions can be made. Also, specific regions(s) can be rescanned based on the result of the categorization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.