Process for treating a workpiece with hydrofluoric acid and ozone
US6497768B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Aug 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A workpiece or substrate is placed in a support in a reaction chamber. A heated process liquid is sprayed onto the substrate. The thickness of the layer of process liquid formed on the substrate is controlled, e.g., by spinning the substrate. Ozone is introduced into the reaction chamber by injection into the liquid or into the reaction chamber, while the temperature of the substrate is controlled, to chemically process the substrate. The substrate is then rinsed and dried.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.