Method of underfilling a flip-chip semiconductor device
US6498054B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2000 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip underfill method is proposed for the purpose of underfilling a gap formed beneath a semiconductor chip mounted in a flip-chip manner over an underlying surface. The flip-chip underfill method comprises the following procedural steps of: preparing a dispensing needle having an outlet; then, moving the dispensing needle in such a manner as to position the outlet thereof at a corner point between the upper surface and the sidewall of the semiconductor chip; and finally injecting resin at the targeted corner point, which allows the injected resin from the outlet of the dispensing needle to flow down along the sidewall of the semiconductor chip to the edge of the lower surface of the semiconductor chip and subsequently fill into the gap through capillary action. This flip-chip underfill method is more advantageous to use than the prior art since it allows the dispensing needle to be unobstructed by any gold wires or passive components mounted beside the chip and also allows the injected resin to be substantially confined to the targeted area beneath the chip without being wasted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.