Resist film removing composition and method for manufacturing thin film circuit element using the composition
US6500270B2 · kind B2 · utility
3Cited by
5References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 21, 1998 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Oct 21, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A resist film removing composition used in the manufacture of a thin film circuit element having an organic insulation film which comprises 50 to 70% by weight of an alkanolamine having 3 or more carbon atoms, 20 to 30% by weight of a water-miscible solvent and 10 to 20% by weight of water. The resist film removing composition can easily remove a resist film remaining after etching, without swelling the organic insulation film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.