Plating apparatus for detecting the conductivity between plating contacts on a substrate
US6500317B1 · kind B1 · utility
5Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Jun 16, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/54
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.