Gas inlets for wafer processing chamber

US6500734B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Roger N. Anderson · New York, US
• Peter Hey · Sunnyvale, US
• David K. Carlson · San Jose, US
• Mahalingam Venkatesan · San Jose, US
• Norma Riley · Pleasanton, US

Key dates

• Filing date: Jun 2, 1999
• Grant date: Dec 31, 2002
• Expiry date: Jun 2, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67023
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A system for supplying processing fluid to a substrate processing apparatus having walls, the inner surfaces of which define a processing chamber in which a substrate supporting susceptor is located. The system consists of a number of fluid storages, each which stores a separate processing fluid, at least two fluid conduits along which processing fluid flows from the fluid storages to the processing apparatus and a fluid inlet which connects the fluid conduits to the processing chamber. The inlet has a separate fluid passage, corresponding to each of the fluid conduits, formed along it. Each fluid passage opens at or near an inner surface of a wall to define a fluid mixing zone, so that fluid moving along one fluid passage is prevented from mixing with fluid moving along any other passage until reaching the mixing zone.