Room temperature wafer-to-wafer bonding by polydimethylsiloxane
US6503847B2 · kind B2 · utility
15Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | May 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2007
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of forming bonds between similar and dissimilar material surfaces particularly the surfaces of silicon wafers having various devices disposes thereon, wherein such bonds can be formed at room temperature and do not require the application of high pressures or voltages. The bonding material is polydimethylsiloxane, which is transparent and bio-compatible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.