Method for controlling airflow on a backside of a semiconductor wafer during spin processing
US6505417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Jan 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.