Deadhesion method and mechanism for wafer processing
US6506679B2 · kind B2 · utility
9Cited by
56References
183Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Aug 29, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed flexible planar interface material contacting the deformable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.