Semiconductor package with embedded heat-dissipating device
US6507104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Jul 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the toning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned beat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e. an exposed side of the heat sink to the atmosphere, so that the heat-dissipating efficiency is increase and the semiconductor package is more cost-effective to fabricate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.