Low profile mounting of thick integrated circuit packages within low-profile circuit modules
US6509637B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2002 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Mar 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly and method for mounting thick integrated circuit packages within a low-profile circuit module provides a low cost alternative to special integrated circuit packaging requirements. Pre-packaged thin-small-outline-packages (TSOP), thin-plastic-quad-flatpack (TQFP) and other similar surface mount packages may be used within a low-profile circuit module, using the techniques and structures of the present invention. A straight lead package is mounted within a cavity in the circuit module substrate, so that the effective height of the integrated circuit package is reduced. Curved lead packages are used by straightening or sawing the leads before mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.