Markus K. Liebhard
11Patents
6h-index
11Co-inventors
55Inventor score
Filing activity: Nov 15, 1996 → Jan 13, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6589801B1 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Electricity | 26 | Expired |
| US6509560B1 | Chip size image sensor in wirebond package with step-up ring for electrical contact | Electricity | 21 | Expired |
| US6528857B1 | Chip size image sensor bumped package | Electricity | 18 | Expired |
| US6486537B1 | Semiconductor package with warpage resistant substrate | Electricity | 16 | Expired |
| US5764484A | Ground ring for a metal electronic package | Electricity | 14 | Expired |
| US6717822B1 | Lead-frame method and circuit module assembly including edge stiffener | Electricity | 9 | Expired |
| US6900527B1 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Electricity | 5 | Expired |
| US6629633B1 | Chip size image sensor bumped package fabrication method | Electricity | 5 | Expired |
| US6620646B1 | Chip size image sensor wirebond package fabrication method | Electricity | 4 | Expired |
| US6509637B1 | Low profile mounting of thick integrated circuit packages within low-profile circuit modules | Electricity | 1 | Expired |
| US7176062B1 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.