Method and apparatus for reducing deposition variation by modeling post-clean chamber performance
US6512991B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2000 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Aug 30, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for reducing deposition thickness variation in a processing tool comprises storing a post-clean performance model of the processing tool; receiving at least one of a showerhead age and a tool idle time associated with the processing tool as an input parameter; determining temperature control parameters based on the input parameter and the post-clean performance model; and modifying an operating recipe of the processing tool based on the temperature control parameters. A processing system includes a processing tool and an automatic process controller. The processing tool is adapted to process wafers in accordance with an operating recipe. The automatic process controller is adapted to store a post-clean performance model of the processing tool, receive at least one of a showerhead age and a tool idle time associated with the processing tool as an input parameter, determine temperature control parameters based on the input parameter and the post-clean performance model, and modify the operating recipe of the processing tool based on the temperature control parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.