Hydraulically actuated wafer clamp
US6513848B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1999 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Sep 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a wafer clamping mechanism responsive to fluid pressure to retain wafers on a surface with minimal clamping force. The clamping mechanism houses simple operative elements within a housing proximate the wafer and can utilize existing fluid pressure sources to energize the clamping mechanism. In a first embodiment, the clamping mechanism includes a piston and cylinder to urge a clamping arm against the wafer in response to fluid pressure. In a second embodiment, the clamping mechanism includes a bellows arrangement for urging the clamping finger against the wafer in response to a fluid pressure source. In a third embodiment, the clamping mechanism includes a bladder arrangement wherein a bladder is expanded using fluid pressure to urge the clamping arm against the wafer in response to a fluid pressure source. In a fourth embodiment, the clamping mechanism includes a flexure member attached to a dual bellows arrangement for urging the flexure member against the wafer in response to a vacuum pressure source. In a fifth embodiment, the clamping mechanism includes a bent flexure member attached to a dual bellows arrangement with an internal piston and…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.