Adjustable flange for plating and electropolishing thickness profile control
US6514393B1 · kind B1 · utility
15Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2000 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Apr 4, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical reactor is used to electrofill damascene architecture for integrated circuits or for electropolishing magnetic disks. An inflatable bladder is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The bladder establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.