Robert J. Contolini
30Patents
21h-index
26Co-inventors
81Inventor score
Filing activity: May 8, 1989 → Feb 11, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5096550A | Method and apparatus for spatially uniform electropolishing and electrolytic etching | Emerging Cross-Sectional Technologies | 213 | Expired |
| US6126798A | Electroplating anode including membrane partition system and method of preventing passivation of same | Chemistry; Metallurgy | 205 | Expired |
| US6074544A | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 203 | Expired |
| US5099311A | Microchannel heat sink assembly | Electricity | 160 | Expired |
| US6099702A | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability | Chemistry; Metallurgy | 157 | Expired |
| US6162344A | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 152 | Expired |
| US6159354A | Electric potential shaping method for electroplating | Chemistry; Metallurgy | 146 | Expired |
| US6110346A | Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 131 | Expired |
| US5256565A | Electrochemical planarization | Electricity | 114 | Expired |
| US6402923B1 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Emerging Cross-Sectional Technologies | 102 | Expired |
| US6569299B1 | Membrane partition system for plating of wafers | Chemistry; Metallurgy | 80 | Expired |
| US6193859A | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Chemistry; Metallurgy | 74 | Expired |
| US5486234A | Removal of field and embedded metal by spin spray etching | Electricity | 63 | Expired |
| US6315883A | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing | Electricity | 61 | Expired |
| US6551483B1 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Chemistry; Metallurgy | 61 | Expired |
| US7070686B2 | Dynamically variable field shaping element | Chemistry; Metallurgy | 61 | Expired |
| US5653019A | Repairable chip bonding/interconnect process | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5658832A | Method of forming a spacer for field emission flat panel displays | Electricity | 36 | Expired |
| US6033583A | Vapor etching of nuclear tracks in dielectric materials | Chemistry; Metallurgy | 31 | Expired |
| US6562204B1 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Chemistry; Metallurgy | 28 | Expired |
| US6709565B2 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Electricity | 21 | Expired |
| US6214193A | Electroplating process including pre-wetting and rinsing | Chemistry; Metallurgy | 19 | Expired |
| US6716334B1 | Electroplating process chamber and method with pre-wetting and rinsing capability | Chemistry; Metallurgy | 19 | Expired |
| US6514393B1 | Adjustable flange for plating and electropolishing thickness profile control | Chemistry; Metallurgy | 15 | Expired |
| US6193870A | Use of a hard mask for formation of gate and dielectric via nanofilament field emission devices | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.