Micro-BGA beam lead connection with cantilevered beam leads
US6515354B1 · kind B1 · utility
1Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2000 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape automated bonding (TAB) tape is provided with an insulating tape having a die receiving section. The TAB tape also has a conductive wiring pattern forming a plurality of traces including a land at one end and a beam lead at another end. A tape window is formed in a portion of the tape die receiving section. At least one trace beam lead extends over the tape window from a first direction and is connected to a tie bar adjacent an opposing side of the tape window and at least one trace beam lead extends over the tape window from a second direction different than the first direction and is cantilevered over the tape window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.