Method of transporting a semiconductor wafer in a wafer polishing system
US6517418B2 · kind B2 · utility
8Cited by
84References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.