Chemical vapor deposition chamber lid assembly
US6517634B2 · kind B2 · utility
22Cited by
12References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor substrate processing chamber is disclosed generally comprising a chamber body that has a semiconductor substrate support assembly disposed in the chamber body. A lid assembly is movably coupled to the chamber body via a dual pivot hinge assembly. The hinge assembly provides two pivot points that minimize the abrasion and pinching of an o-ring disposed between the lid assembly and the chamber body upon closing of the lid assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.