Plating device
US6517689B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/54
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.