Substrate processing system
US6517691B1 · kind B1 · utility
22Cited by
5References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | May 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system configuration. A dual processing module, including first and second process stations, is selectably operable in a serial mode or a parallel mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.